to deliver next-gen thermoelectric modules.
DTP Thermoelectrics has been awarded a U.S. National Science Foundation (NSF) Small Business Innovation Research (SBIR) grant for $275,000 to conduct research and development work on its next generation solid-state cooling technology. Addressing the challenges of conventional cooling methods, this cutting-edge solution offers compact, energy-efficient cooling, heating and thermal management for electronics, pharmaceuticals, food and beverage, logistics and other industries that rely on temperature-controlled environments.
The SBIR grant enables DTP to fast-track the development of its DTP-90 thermoelectric module, which leverages patented composite materials with distributed transport properties (DTP). The Phase I goal is to create and deliver prototype DTP-90 modules that boast three times the cooling efficiency of current solutions at high temperature differentials (e.g. 70K) and can achieve a 90K temperature differential from room temperature. As DTP accelerates its R&D efforts, the prototype module will serve as a platform for developing commercial cooling, heating and thermal management systems tailored for high-performance applications.
“NSF accelerates the translation of emerging technologies into transformative new products and services,” said Erwin Gianchandani, NSF assistant director for technology, innovation and partnerships. “We take great pride in funding deep-technology startups and small businesses that will shape science and engineering results into meaningful solutions for today and tomorrow.”
“Receiving this NSF grant allows us to move more quickly from research to the delivery of solutions that our customers can benefit from today,” said Dr. Lon Bell, CEO of DTP Thermoelectrics. “The DTP-90 module is designed to provide unmatched solid-state cooling efficiency, and with this funding, we are accelerating our ability to bring these innovations directly to the market.”
For more information, visit dtpthermoelectrics.com.
