AI-ready ultra-compact module for industrial handheld devices.
At Embedded World 2025, Thundercomm announced the release of its new TurboX C6690 SOM (system-on-module). Built on Qualcomm’s 4nm-process QCS6690 chipset platform, the SOM is engineered for industrial handheld devices, industrial tablets, edge computing, and smart retail applications, empowering customers to rapidly prototype and deploy advanced terminal equipment.
Comprehensive AI performance
The TurboX C6690 SOM, powered by Qualcomm QCS6690 chipset and equipped with the Kryo CPU and Adreno GPU, delivers 6 TOPS AI performance, driving innovation for on-device AI applications.
With pin-to-pin compatibility across Thundercomm SOMs, the TurboX C6690 meets diverse needs, from low-end to high-end application scenarios. This design effectively helps customers build future-proof solutions while minimizing R&D costs and accelerating time-to-market.
Ultra-compact design
The TurboX C6690 SOM is very small in size. Its compact footprint simplifies production, improves yield rates, and meets stringent size requirements for space-constrained applications.
Flexible customization
TurboX C6690 SOM supports modular feature packages and abundant PCIe resources for peripheral expansion, including Wi-Fi and Bluetooth modules. Its adaptability ensures tailored configurations for diverse use cases while maximizing ROI.
Advanced video codec capabilities
With support for 4K@60fps encoding, 4K@120fps decoding, and four MIPI CSI interfaces for multi-camera data processing, the TurboX C6690 SOM is ideal for dashcams, smart displays, 4K video streaming, and beyond.
For more information, visit thundercomm.com.
