Award recognizes the leading new products for electronics assembly.
DuPont has announced that its DuPont Pyralux ML Series of double-sided metal-clad laminates, has received the 2025 NPI Award in the Laminates category. The NPI Award, presented by Circuits Assembly, a publication run by PCEA (Printed Circuit Engineering Association), recognizes the most innovative and leading new products within the electronics assembly industry, including equipment, materials, and software, as judged by an independent panel of practicing industry engineers.
Launched in April 2024, Pyralux ML laminates are a unique addition to the extensive family of Pyralux laminates for flexible and rigid-flex printed circuit boards (PCBs). Developed for optimal thermal management, these laminates are an ideal solution for high-reliability markets such as aerospace, defense, electric vehicles (EVs), artificial intelligence (AI)-related networking and other electronic devices. The Pyralux ML laminate series provides exceptional performance in challenging environments, making it a versatile and innovative solution for many different applications.
Evaluations were based on a variety of criteria including creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, performance, user-friendliness, and speed/throughput. DuPont’s trailblazing Pyralux ML laminates contain metal alloy, such as copper-nickel (CuNi), featuring Kapton all-polyimide dielectric technology. The alloys provide optimized resistivity for higher heat output, reduced thermal conductivity for better control of heat transfer, and thermoelectric properties as needed for the application.
To learn more about DuPont’s Pyralux ML laminates and other offerings, visit DuPont Interconnect Solutions at IPC APEX Expo.
For more information, visit dupont.com/electronics-industrial.html.
