Nickel-based alloys designed for oil and gas and semiconductor and chemical applications.
Additive manufacturing (AM) supplier EOS has announced the availability of two new metal materials: EOS NickelAlloy IN718 API and EOS Nickel NiCP – both designed to deliver excellent performance and part properties for EOS Laser Powder Bed Fusion (LBPF) 3D printing technology.
EOS NickelAlloy IN718 API is intended for high-performance oil and gas applications with API 6ACRA standard requirements. The nickel-based material is designed to combine high-impact toughness at low temperatures with corrosion resistance for high-stress oil and gas applications. With a tensile strength of 878 MPa and 27% elongation, when combined with a specific heat treatment, this material meets the requirements for API 6ACRA standardization, making it suitable for oil and gas manufacturers to use for downhole, injection and fixture, and fastener applications, among others.
According to EOS, a leading inflow control technology organization provided an early test case for EOS NickelAlloy IN718 API, producing a flow module component meeting API standardization and high-strength performance while being subjected to the corrosive environment of oil and gas equipment.
“Additive manufacturing has previously been out of reach as a solution for demanding downhole applications due to the stringent requirements of the oil and gas industry,” the inflow control customer was quoted as stating in an EOS press release. “With the development of EOS NickelAlloy 718 API, we are now able to evaluate industrial 3D printing’s business case for our manufacturing needs, while ensuring all facets of part performance remain unchanged.”
EOS Nickel NiCP is designed for semiconductor and chemical applications requiring Nickel purity, corrosion resistance and ductility.This material provides a tensile strength of 400 MPa and 49% elongation, making it suitable for applications such as gas injectors and corrosion-resistant components within semiconductor capital equipment.
Traditionally manufactured applications in the semiconductor equipment industry often include electroless nickel plating to increase the corrosion resistance in chemically harsh conditions. If parts can now be manufactured entirely with EOS Nickel NiCP, that eliminates the need for plating and thereby extends the life of the consumable.
“By additively manufacturing these parts, manufacturers can maximize machine uptime and availability, which in turn increases overall throughput of the wafer fabrication process and benefits the end user’s revenue,” said Sophia Heyl, EOS product specialist in the same press release. “Eliminating the electroplating process that generates hazardous waste offers a cleaner, more sustainable manufacturing process for the future.”
“EOS Nickel NiCP has already been successfully deployed in production settings, demonstrating its reliability and performance,” said Ankit Saharan, EOS director of metals technology. “By making it more broadly available, we continue to strengthen our engagement with the semiconductor industry and our dedication to advancing their applications through innovative materials and processes. We look forward to working with our partners to push the boundaries of what’s possible with NiCP in additive manufacturing.”
EOS NickelAlloy IN718 API is available for all metal EOS systems with standard EOS IN718 parameter processes. EOS Nickel NiCP is commercially available for EOS M 290 and EOS M 400-4 systems.
