ACCM manufactures advanced buildup and UHDI dielectric materials globally.
SAN JOSE, CA, Jan 27, 2025- Advanced Chip and Circuit Materials Inc. (ACCM) has announced the introduction of the CeleritasSF and CeleritasBU series of laminates and prepregs, which enable PCIe Gen 6 & 7 and data rates of 224 Gb/s per channel.
The ultra-thin, Buildup and UHDI reinforced materials use a halogen free and PFAS free resin system that has been engineered to eliminate skew. The products have a very low Z-axis coefficient of thermal expansion (z-CTE) and are easy to process using conventional FR-4 process equipment making them suitable for very high reliability plated through hole, HDI and UHDI applications requiring superior thermal cycling capability.
Michael Gay, vice president marketing at ACCM, stated, “The industry requires a product with electrical properties of a PTFE material and our CeleritasSF Series of materials exhibits dielectric performance on par with PTFE and thermal performance exceeding high-reliability expectations. We are confident that PCB designers will find that our skew free CeleritasSF material solution will enable use of on board copper channels to achieve 224 Gbps data rates.”
Additionally, there is also a strong need for ultrathin dielectrics with low DK and Low Dissipation factor for the substrate market and CeleritasBU series of products are designed to offer excellent shelf life and the lowest loss and DK for this segment.
For more information, visit adv-ccm.com.
